About Us
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- Address：1st Floor,Jinda
- Technology Center,No.8 Kefeng
- Road,High-tech Industrial
- Park,Nanshan District,Shenzhen,
- Guangdong,China.
- Zip code：518057
- Tel：+86-755-26616099
- Fax：+86-755-26616090
Capacity
| Item | Detail List |
| Product Range | Double-Sided,Multilayer,Blind-buried Hole,HDI,Environment-friendly Products |
| Layers | 1 to 32 layers |
| Base Material | Low-TG material：FR4(TG135),CEM-1,CEM-3,Aluminium substrates, High-TG material：FR4(TG170),Rogers4003,Rogers4350,TEFLON,TACONIC,ARLON,Halogen-free |
| Surface Treatment | "Lead Free HAL,HAL,Panel Gold Plating,ENIG,OSP,Immersion Tin,Immersion Silver,Gold Finger Plating,Carbon Ink Printing. " |
| Selective Surface Treatment | ENIG+OSP,ENIG+G/F,Panel Gold+Tin Plating,Panel Gold Plating+G/F,Immersion Silver+G/F,Immersion Tin+G/F |
| Plating Thickness | A,Flash Gold Ni:100u"-150u" Au:1u"-3u" B,Imersion Gold Ni:100u"-150u" Au:1u"-3u" C,Gold Finger Ni:120u"-150u" Au:10u"-50u" D,Immersion Tin Sn:30u"-60u" E,Immersion Silver Ag:4u"-11u" F,Gold Plating Ag:u"-50u" G,Gold Plating Bonding Au:8u"-10u" |
| Max Panel Size | 23inch*35inch(Length>30inch need to be check on) |
| Copper Clad Thickness | 18um,35um,70um,105um,140um |
| Board Thickness | 0.13mm-7.0mm(if the panel size≤18in,the board thickness should be less than ≤0.5mm) |
| PTH Thickness | 20-25um |
| Ink Color | Red,Green,Yellow,Black,Blue or Transparent Wet film SM,Peelable Ink. |
| Idents Color | White,Yellow,Black |
| Minimum Line Width | 3mil |
| Minimum Line Space | 3mil |
| Minimum Line-Pad,Pad-Pad Spacing | 3mil |
| Minimum Hole Diameter | 0.10mm /4mil |
| Minimum Via Hole Pad Diameter | 12mil |
| Max Diameter-to-thickness Ratio | 1:12:00 |
| Finish Board Thinckness Tolerance | (≤1.0mm) ±0.1mm (>1.0mm) ±10% |
| HDI Type | 1+n+1,1+1+n+1+1,2+n+2(Buried Hole in n≤0.3,2 ranks need to be check on) |
| Impedance Control | Characteristic Impedance/Differential Impedance |
| Impedance Tolerance | ±10% |
| Minimum Laser-drilling Hole | 0.10mm(Depth≤55um),0.13(Depth≤100um) |
| Board Bow and Twist | Double-Sided ≤0.7% Multilayer ≤0.7% |
| Profiling | Routing；V-CUT；Bridging；Stamp Hole |
| Data File Formats | GERBER File and Drilling File Related,PROTEL Series,Powerpcb Series,PADS2005,ODB++,AUTOCAD |
| E-Test | 100% E-Test；High Voltage Testing |
| Other Test | Impedance Test,Resistance In Hole Test,Micro Sectioning；Solderability Test,Thermal Shock and Termly Reliability Test |
| Assembly | SMT |